On September 9, 2022, President Joe Biden joined Intel, Ohio Gov. Mike DeWine and other federal, state and local officials to celebrate breaking ground in the Silicon Heartland on two of the world’s most advanced chipmaking facilities. As part of Intel’s commitment to develop a skilled talent pipeline for its two new leading-edge chip fabs, Intel also announced the first phase of funding for its Ohio Semiconductor Education and Research Program. During this first phase, Intel is providing $17.7 million for eight proposals from leading institutions and collaborators in Ohio to develop semiconductor-focused education and workforce programs. Click here to read more.
Intel Breaks Ground in the Silicon Heartland
Follow Us & Use #newalbanyohio
5 days ago
Video
Share on Facebook Share on Twitter Share on Linked In Share by Email
5 days ago
Photo
Share on Facebook Share on Twitter Share on Linked In Share by Email
5 days ago
Video
Share on Facebook Share on Twitter Share on Linked In Share by Email
5 days ago
Photo
Share on Facebook Share on Twitter Share on Linked In Share by Email
6 days ago
Photo
Share on Facebook Share on Twitter Share on Linked In Share by Email